The nano heat insulation board is formed by using light weight, inorganic nano SiO 2 and ceramic fiber with extremely low thermal conductivity as raw materials and aluminum foil with high reflectivity as bottom material, adopting a single-layer composite structure to be continuously coated and matched with a pressing and baking process, and has the thermal conductivity smaller than that of static air, and the thermal insulation performance is about 4 - 6 times better than that of the traditional thermal insulation material, so the nano heat insulation board is the thermal insulation material with the best performance so far.
The nano heat insulation board has ultra-low thermal conductivity, can greatly save energy compared with the traditional heat insulation material, and has a pipe diameter of 150 mm.. For example, for pipelines with a temperature of 600 degrees, when the thickness is only one third of the thickness of conventional mineral wool, 1,400 degrees of electricity is saved per meter of pipeline per year, and the total length of 1,000 meters of pipeline saves about 1.4 million degrees of energy per year.
Characteristics and functions
High temperature resistance - long-term use temperature of 400 ~ 1000 degrees
Thermal conductivity - 2 ~ 10 times lower than the conventional thermal insulation material, only 0.052 w / m k at 800 degrees
Durability - can be used as insulation permanent layer, service life of more than 5 ~ 10 years
Safety and environmental protection - pure non-polar material combination, good thermal stability, no release of any harmful substances
Economic analysis - the price is lower than 50 % of foreign similar products, 10 ~ 30 % energy saving than conventional materials
Product Name | JSGW-1050 Nano heat insulation board | Inspection Standard | |
Product Code | JSGW-1050 | ||
Melting Point | ≥1200℃ | ||
Usage Temperature | 1050℃ | ||
Density (±10%) | 320kg/m3 | GB/T17911-2006 | |
Specific Heat Capacity(400℃) | 0.8kJ/kg.k | YB/T4130-2005 | |
Compressive strength ( compression 10 % ) | 0.3MPa | GB/T 13480-1992 | |
Linear Shrinkage (800℃) | 2.0% | GB/T17U911-2006 | |
Thermal Conductivity(w/m.k) | 70℃ | 0.019 | YB/T4130-2005 |
200℃ | 0.021 | ||
400℃ | 0.024 | ||
600℃ | 0.031 | ||
800℃ | 0.040 |
( note: the above data are representative averages obtained according to common test methods and vary with fluctuations in normal production conditions. these data are provided as part of a technical service and may sometimes be adjusted, so they should not be considered product indicators. )
Hot and cold surface temperature self-examination table
Nano thermal insulation board has excellent thermal insulation performance, because of its thermal conductivity is very small, only 1 / 3 ~ 1 / 4 of the traditional thermal insulation materials, therefore, under the condition of guarantee the same cold surface temperature insulation thickness can be very thin, that is to say, under the condition of insulation thickness cannot be too thick, can the cold surface temperature as far as possible to the lowest, because the site thermal conditions are complex and changeable, the thermal insulation effect under the same conditions is not the same.
Thickness(MM) | Hot surface temperature(℃) | 1000℃ Heat dissapation w/m | ||||||||||
200 | 300 | 400 | 500 | 600 | 700 | 800 | 850 | 900 | 950 | 1000 | ||
3 | 85 | 117 | 146 | 175 | 210 | 239 | 269 | 288 | 308 | 319 | 339 | 9489 |
5 | 68 | 91 | 115 | 138 | 161 | 184 | 215 | 223 | 240 | 257 | 265 | 5849 |
7 | 58 | 77 | 95 | 116 | 136 | 155 | 176 | 190 | 197 | 212 | 227 | 4394 |
10 | 50 | 65 | 79 | 94 | 112 | 128 | 146 | 158 | 164 | 177 | 183 | 2999 |
15 | 64 | 75 | 87 | 103 | 117 | 122 | 132 | 137 | 147 | 2087 | ||
20 | 65 | 74 | 85 | 96 | 104 | 113 | 117 | 126 | 1604 | |||
25 | 66 | 75 | 85 | 92 | 95 | 103 | 111 | 1305 | ||||
30 | 68 | 76 | 83 | 86 | 93 | 96 | 1025 | |||||
35 | 70 | 76 | 78 | 85 | 87 | 887 | ||||||
40 | 70 | 73 | 78 | 81 | 781 | |||||||
45 | 68 | 73 | 76 | 698 | ||||||||
50 | 69 | 71 | 632 |