The nano heat insulation board is formed by using light weight, inorganic nano SiO 2 and ceramic fiber with extremely low thermal conductivity as raw materials and aluminum foil with high reflectivity as bottom material, adopting a single-layer composite structure to be continuously coated and matched with a pressing and baking process, and has the thermal conductivity smaller than that of static air, and the thermal insulation performance is about 4 - 6 times better than that of the traditional thermal insulation material, so the nano heat insulation board is the thermal insulation material with the best performance so far.
The nano heat insulation board has ultra-low thermal conductivity, can greatly save energy compared with the traditional heat insulation material, and has a pipe diameter of 150 mm.. For example, for pipelines with a temperature of 600 degrees, when the thickness is only one third of the thickness of conventional mineral wool, 1,400 degrees of electricity is saved per meter of pipeline per year, and the total length of 1,000 meters of pipeline saves about 1.4 million degrees of energy per year.
Characteristics and functions
High temperature resistance - long-term use temperature of 400 ~ 1000 degrees
Thermal conductivity - 2 ~ 10 times lower than the conventional thermal insulation material, only 0.052 w / m k at 800 degrees
Durability - can be used as insulation permanent layer, service life of more than 5 ~ 10 years
Safety and environmental protection - pure non-polar material combination, good thermal stability, no release of any harmful substances
Economic analysis - the price is lower than 50 % of foreign similar products, 10 ~ 30 % energy saving than conventional materials
Product name | JSGW-1100 Nano heat insulation board | Inspection Standard | |
Product Code | JSGW-1100 | ||
Melting point | ≥1200℃ | ||
Usage temperature | 1100℃ | ||
Density (±10%) | 320kg/m3 | GB/T17911-2006 | |
Specific heat capacity(400℃) | 0.8kJ/kg.k | YB/T4130-2005 | |
Compressive strength ( compression 10 % ) | 0.3MPa | GB/T 13480-1992 | |
Linear Shrinkage(800℃) | 2.0% | GB/T17U911-2006 | |
Thermal Conductivity(w/m.k) | 70℃ | 0.019 | YB/T4130-2005 |
200℃ | 0.021 | ||
400℃ | 0.024 | ||
600℃ | 0.031 | ||
800℃ | 0.040 |
( note: the above data are representative averages obtained according to common test methods and vary with fluctuations in normal production conditions. these data are provided as part of a technical service and may sometimes be adjusted, so they should not be considered product indicators. )
Hot and cold surface temperature self-examination table
Nano thermal insulation board has excellent thermal insulation performance, because of its thermal conductivity is very small, only 1 / 3 ~ 1 / 4 of the traditional thermal insulation materials, therefore, under the condition of guarantee the same cold surface temperature insulation thickness can be very thin, that is to say, under the condition of insulation thickness cannot be too thick, can the cold surface temperature as far as possible to the lowest, because the site thermal conditions are complex and changeable, the thermal insulation effect under the same conditions is not the same.
Thickness(MM) | Hot surface temperature(℃) | 1000℃ Heat dissipation w/m | ||||||||||
200 | 300 | 400 | 500 | 600 | 700 | 800 | 850 | 900 | 950 | 1000 | ||
3 | 85 | 117 | 146 | 175 | 210 | 239 | 269 | 288 | 308 | 319 | 339 | 9489 |
5 | 68 | 91 | 115 | 138 | 161 | 184 | 215 | 223 | 240 | 257 | 265 | 5849 |
7 | 58 | 77 | 95 | 116 | 136 | 155 | 176 | 190 | 197 | 212 | 227 | 4394 |
10 | 50 | 65 | 79 | 94 | 112 | 128 | 146 | 158 | 164 | 177 | 183 | 2999 |
15 | 64 | 75 | 87 | 103 | 117 | 122 | 132 | 137 | 147 | 2087 | ||
20 | 65 | 74 | 85 | 96 | 104 | 113 | 117 | 126 | 1604 | |||
25 | 66 | 75 | 85 | 92 | 95 | 103 | 111 | 1305 | ||||
30 | 68 | 76 | 83 | 86 | 93 | 96 | 1025 | |||||
35 | 70 | 76 | 78 | 85 | 87 | 887 | ||||||
40 | 70 | 73 | 78 | 81 | 781 | |||||||
45 | 68 | 73 | 76 | 698 | ||||||||
50 | 69 | 71 | 632 |
Application areas:
Metallurgy: ladle, ladle, tundish, converter, torpedo ladle
Machinery: industrial furnace, electric furnace, furnace door, furnace cover
Automobile: engine heat shield, catalytic exhaust pipe
Petrochemical: cracking furnace, conversion furnace, heating furnace
Power: boilers, steam turbines, pipelines
Building materials: ceramic furnace, rotary furnace
Use effect:
Reduce that thickness of the heat insulation layer
Since that thickness of the thermal lay can be greatly reduced, the heat insulation device can be miniaturize and the volume of the device can be increased
Reduced heat storage
The heat storage of the heat insulation layer is reduced, and the heating time of the furnace is greatly shortened, so that not only energy is saved, but also the effect of improving productivity and being easy to control temperature can be achieved by the gold and stone nano microporous heat insulation material.
Reduce heat dissipation
Because the heat insulation effect can be achieved by using a thinner nano microporous heat insulation material, the heat dissipation surface area can be reduced, and the heat loss can be greatly reduced. Therefore, the surface temperature of the furnace can be reduced and the working environment can be improved.
Temperature homogenization
The invention has the effect of reducing heat loss, can realize the homogenization of the temperature to the maximum extent, and can lead the metal solution, the glass solution and the heat treatment product of the kiln to be more uniform in temperature and improve the product quality as a result.