The nano thermal insulation board is formed by using light, inorganic nano SiO 2 and ceramic fiber with extremely low thermal conductivity as raw materials and aluminum foil with high reflectivity as the bottom layer material, and adopting a single-layer composite structure to be continuously coated and matched with a pressing and baking process, the thermal conductivity of the nano thermal insulation board is smaller than that of static air, and the thermal insulation performance is about 4 - 6 times better than that of the traditional thermal insulation material, so the nano thermal insulation board is the thermal insulation material with the best performance so far.
The nano thermal insulation board has ultra-low thermal conductivity and can greatly save energy compared with the traditional thermal insulation materials, and the diameter of the nano thermal insulation board is 150 mm.. Temperature of 600 degrees of pipeline, for example, in the use of thickness is only one third of the thickness of the traditional mineral wool, per meter of pipeline save 1400 degrees of electricity per year, the total length of 1000 meters of pipeline save energy about 1.4 million degrees of electricity per year.
Characteristics and functions
High temperature resistance - long-term use temperature of 400 ~ 1000 degrees
Thermal conductivity - 2 ~ 10 times lower than the conventional thermal insulation material, only 0.052 w / m k at 800 degrees
Durability - can be used as insulation permanent layer, service life of more than 5 ~ 10 years
Safety and environmental protection - pure non-polar material combination, good thermal stability, no release of any harmful substances
Economic analysis - the price is lower than 50 % of foreign similar products, 10 ~ 30 % energy saving than conventional materials
Product Name |
Nano Insulation board JSGW-1100 |
Inspection Standard |
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Product Code |
JSGW-1100 |
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Melting point |
≥1200℃ |
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Use Temperature |
1050℃ |
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Density (±10%) |
320kg/m3 |
GB/T17911-2006 |
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Specific Heat Capacity(400℃) |
0.8kJ/kg.k |
YB/T4130-2005 |
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Compressive strength( compression10%) |
0.3MPa |
GB/T 13480-1992 |
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Linear Shrinkrage(800℃) |
2.0% |
GB/T17U911-2006 |
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Thermal conductivity(w/m.k) |
70℃ |
0.019 |
YB/T4130-2005 |
200℃ |
0.021 |
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400℃ |
0.024 |
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600℃ |
0.031 |
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800℃ |
0.040 |
( note: the above data are representative averages based on common test methods and vary with fluctuations in normal production conditions and are provided as part of a technical service and may sometimes be adjusted, so they should not be considered product indicators. )
Cold and hot surface temperature self-examination table
Nano thermal insulation board has excellent thermal insulation performance, because its thermal conductivity is very small, only 1 / 3 ~ 1 / 4 of the traditional thermal insulation material, therefore, under the condition of ensuring the same cold surface temperature insulation thickness can be very thin, that is to say, under the condition of the insulation thickness can not be too thick, cold surface temperature can be reduced to a minimum as much as possible, due to the complex and changeable thermal conditions in the field, the same conditions of thermal insulation effect is not the same.
Thinckness(MM) | Hot surface temperature(℃) | 1000℃ heat dissipation w/m | ||||||||||
200 | 300 | 400 | 500 | 600 | 700 | 800 | 850 | 900 | 950 | 1000 | ||
3 | 85 | 117 | 146 | 175 | 210 | 239 | 269 | 288 | 308 | 319 | 339 | 9489 |
5 | 68 | 91 | 115 | 138 | 161 | 184 | 215 | 223 | 240 | 257 | 265 | 5849 |
7 | 58 | 77 | 95 | 116 | 136 | 155 | 176 | 190 | 197 | 212 | 227 | 4394 |
10 | 50 | 65 | 79 | 94 | 112 | 128 | 146 | 158 | 164 | 177 | 183 | 2999 |
15 | 64 | 75 | 87 | 103 | 117 | 122 | 132 | 137 | 147 | 2087 | ||
20 | 65 | 74 | 85 | 96 | 104 | 113 | 117 | 126 | 1604 | |||
25 | 66 | 75 | 85 | 92 | 95 | 103 | 111 | 1305 | ||||
30 | 68 | 76 | 83 | 86 | 93 | 96 | 1025 | |||||
35 | 70 | 76 | 78 | 85 | 87 | 887 | ||||||
40 | 70 | 73 | 78 | 81 | 781 | |||||||
45 | 68 | 73 | 76 | 698 | ||||||||
50 | 69 | 71 | 632 |